Is the layer stack-up from the manufacturer correct?
Dear community,
I recently discovered a promising IC (USB HUB Controller, CCG6DF) for my project. However, I’ve noticed that the recommended layer stack-up provided may not be optimal. Please refer to the screenshot below for details.
In your experience, should hardware designers strictly adhere to the datasheet recommendations, even if they seem less than ideal?
Best Regards,
Nazar Melnichek
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Is the layer stack-up from the manufacturer correct?